By Joe Kelly
That includes important enter from industry-leading businesses and highly-regarded specialists within the box, this first-of-its sort source deals skilled engineers a entire figuring out of the complicated issues in RF, SiP (system-in-package), and SoC (system-on-a-chip) construction trying out which are serious to their paintings regarding semiconductor units. The publication covers key dimension strategies for semiconductor equipment checking out and assists engineers in explaining those techniques to administration to help reduce venture expense, time, and assets. in accordance with real-world event and choked with time-saving equations, this in-depth quantity bargains pros functional info on crucial themes that experience by no means been awarded in one reference ahead of.
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Additional resources for Advanced Production Testing of RF, SoC, and SiP Devices
Therefore, because a short test time is one of the key objectives for every test engineer, the right compromise has to be found between small measurement bandwidth in order to perform accurate measurements of low-power signals and a wider measurement bandwidth to save test time. The following sections focus on basic measurements that involve measuring RF power on SoC devices. More advanced concepts of measuring RF power such as distortion measurements are covered in Chapter 3. 1 RF Output Power Measurement When a test program for a transmitter or an amplifier is developed, the RF output power measurement is most likely the test that is implemented first.
Similar to a receiver, the transmitter architecture can be either superheterodyne or ZIF, although the ZIF architecture is more prevalent today. Many of the same tests that are performed on PAs are also performed on transmitters. However, usually the tests are more extensive because the complete transmitter portion of a transceiver often has much more control of output power levels and these must be tested. 6 Testing PLLs and VCOs The phase-locked loop (PLL) and VCO are the low- and high-frequency components of the circuit used to generate the local oscillator (LO) signal that is used in upconversion and downconversion.
1 is the voltage wave that is applied to the input of the device. Likewise, the a2 signal is a voltage wave that is applied to the output of the device; b1 is the voltage wave that can be measured at the input of the device; and b2 is the voltage wave that can be measured at the output of the device. 1 S-parameter definition for a two-port device showing incident and reflected signals. 4) Under the assumption that the output of the two-port device is terminated (a2 = 0), S11 is called the input reflection coefficient.